SMD is an acronym for Surface Mounted Devices, which means: surface mount device, which is one of SMT (Surface Mount Technology) components. At the initial stage of electronic circuit board production, via assembly is completely done by hand. After the first automated machines were introduced, they could place some simple pin elements, but complex components still needed manual placement for wave soldering. Surface Mounted components mainly include rectangular chip components, cylindrical chip components, composite chip components, and odd-shaped chip components.
Smd packageAt the initial stage of electronic circuit board production, via assembly is completely done by hand. After the first automated machines were introduced, they could place some simple pin elements, but complex components still needed manual placement for wave soldering.
1, BGA (ball grid array)
Spherical contact display, one of the surface mount packages. On the back side of the printed circuit board, ball bumps are produced in a display manner instead of pins, an LSI chip is mounted on the front side of the printed circuit board, and then sealed with a molding resin or a potting method. Also known as bump display carrier (PAC). The pin can exceed 200 and is a package for multi-lead LSIs.
The package body can also be made smaller than the QFP (Quad Quad Flat Package). For example, a 360-pin BGA with a 1.5 mm center-to-center spacing is only 31 mm square; a 304-pin QFP with a 0.5 mm center-to-center distance is 40 mm square. And BGA does not have to worry about the pin deformation problem of QFP.
This package was developed by the Motorola Corporation of the United States and was first adopted in portable telephones and other devices, and is likely to be popularized in personal computers in the United States in the future. Initially, the BGA's pins (bumps) have a center-to-center distance of 1.5mm and a pin count of 225. There are also some LSI manufacturers currently developing 500-pin BGAs.
The problem with the BGA is the visual inspection after reflow. It is not yet clear whether or not effective visual inspection methods. Some believe that due to the large center-to-center distance of welding, the connection can be considered as stable and can only be handled through functional inspection.
Motorola Inc. of the United States refers to a package sealed with a molded resin as OMPAC, and a package sealed to a potting method as GPAC (see OMPAC and GPAC).
2. BQFP (quad flat package with bumper)
Buffered quad flat package. One of the QFP packages is provided with protrusions (cushion pads) at the four corners of the package body to prevent bending deformation of the pins during shipping. U.S. semiconductor manufacturers use this package primarily in circuits such as microprocessors and ASICs. The pin center distance is 0.635mm and the pin count is from 84 to 196 (see QFP).
3, butt welding PGA (butt joint pin grid array)
The name of the surface mount PGA (see surface mount PGA).
4, C-(ceramic)
Indicates the symbol of the ceramic package. For example, CDIP stands for Ceramic DIP. It is a mark that is often used in practice.
5, Cerdip
Glass sealed ceramic dual in-line package for ECL RAM, DSP (digital signal processor) and other circuits. Cerdip with a glass window is used for UV erasing EPROM and microcomputer circuits with EPROM inside. The pin center distance is 2.54mm and the pin count is from 8 to 42. In Japan, this package is represented as DIP-G (G means glass seal).
6, Cerquad
One of the surface-mount packages is a lower-encapsulation ceramic QFP used to package logic LSI circuits such as DSPs. Cerquad with windows is used to encapsulate EPROM circuits. The heat dissipation is better than that of the plastic QFP, and 1.5 to 2 W of power can be tolerated under natural air-cooling conditions. However, the packaging cost is 3 to 5 times higher than plastic QFP. The center-to-center distance between pins is 1.27mm, 0.8mm, 0.65mm, 0.5mm, and 0.4mm. Number of pins from 32 to 368.
7, CLCC (ceramic leaded chip carrier)
A ceramic chip carrier with pins, one of the surface mount packages, leads from the four sides of the package in a T shape. Windows with encapsulated UV erasing EPROM and microcomputer circuits with EPROM. This package is also called QFJ, QFJ-G (see QFJ).
8, COB (chip on board)
The chip-on-board package is one of bare chip mounting technologies. The semiconductor chip is mounted on the printed circuit board in an alternating manner. The electrical connection between the chip and the substrate is realized by a wire sewing method. The electrical connection between the chip and the substrate is realized by a wire sewing method and used. Resin covers to ensure reliability. Although COB is the simplest die-attach technology, its packaging density is far inferior to TAB and reflow soldering technology.
9, DFP (dual flat package)
Double sided flat package. Is another name for SOP (see SOP). This method was previously used and is basically not used now.
10, DIC (dual in-line ceramic package) Another name for ceramic DIP (including glass seal) (see DIP).
11. DIL (dual in-line)
Another name for DIP (see DIP). European semiconductor manufacturers use this name more often.
12, DIP (dual in-line package)
Dual in-line package. One of the plug-in packages, the leads are led out from both sides of the package, and the package materials are plastic and ceramic. DIP is the most popular cartridge type package and its applications include standard logic ICs, memory LSIs, and microcomputer circuits. The pin center distance is 2.54mm and the pin number is from 6 to 64. The package width is usually 15.2mm. Some packages with a width of 7.52mm and 10.16mm are called skinny DIP and slim DIP (narrow body type DIP) respectively. However, in most cases, there is no distinction, simply referred to as DIP. In addition, the ceramic DIP sealed with low-melting glass is also called cerdip (see cerdip).
13, DSO (dual small out-lint)
Double sided small outline package. Another name for SOP (see SOP). Some semiconductor manufacturers use this name.
14. DICP (dual tape carrier package)
Double sided lead loaded package. One of TCP (Load with Package). Pins are made on the insulating tape and lead out from both sides of the package. Due to the use of TAB (Automatic On-Board Welding) technology, the package shape is very thin. Commonly used in liquid crystal display driver LSIs, but most are custom products. In addition, a 0.5-mm-thick memory LSI package is under development. In Japan, DICP is named as DTP according to the EIAJ (Japan Electromechanical Industry) Association standards.
15, DIP (dual tape carrier package)
Ibid. Japanese Electromechanical Industry Standards Name the DTCP (see DTCP).
16, FP (flat package)
Flat package. One of the surface mount packages. QFP or SOP (see QFP and SOP). Some semiconductor manufacturers use this name.
17, flip-chip
Solder chip. One of the bare chip packaging techniques is to make a metal bump in the electrode region of the LSI chip, and then press-bond the metal bump to the electrode region on the printed circuit board. The footprint of the package is essentially the same as the chip size. It is the smallest and thinnest of all packaging technologies.
However, if the coefficient of thermal expansion of the substrate is different from that of the LSI chip, a reaction occurs at the joint, thereby affecting the reliability of the connection. Therefore, it is necessary to reinforce the LSI chip with a resin and use a substrate material having substantially the same thermal expansion coefficient.
18. FQFP (fine pitch quad flat package)
Small pin center distance QFP. Usually refers to a QFP with a center-to-center distance of less than 0.65mm (see QFP). Some conductor manufacturers use this name.
19, CPAC (globe top pad array carrier) Motorola company of the United States on the BGA (see BGA).
20ã€CQFP (quad fiat package with guard ring)
Four-lead flat package with guard ring. One of the plastic QFPs, the pins are masked with a resin protection ring to prevent bending deformation. Prior to assembling the LSI on the printed circuit board, the pins were cut off from the guard ring and made into a gull-wing shape (L-shape). This package has been mass-produced at Motorola, USA. The pin center distance is 0.5mm, and the pin count is up to 208 or so.
21, H-(with heat sink)
Indicates the heat sink mark. For example, HSOP represents a SOP with a heat sink.
22, pin grid array (surface mount type)
Surface mount PGA. Usually the PGA is a plug-in package with a pin length of about 3.4mm. The surface-mount PGA has display pins on the bottom surface of the package, and its length is from 1.5mm to 2.0mm. Mounting adopts the method of bump welding with a printed circuit board and is therefore also referred to as touch-welding PGA. Since the center-to-center distance of the leads is only 1.27mm, which is less than half that of the PGA packaged type, the package body can be made not so large, and the number of pins is larger than that of the package type (250 to 528). This is a package for large-scale logic LSIs. . The encapsulated substrate has a multilayer ceramic substrate and a glass epoxy print base. The use of multilayer ceramic substrates for packaging has been practical.
23. JLCC (J-leaded chip carrier)
J-shaped pin chip carrier. Refers to the nicknames of windowed windows CLCC and windowed ceramic QFJ (see CLCC and QFJ). Some semiconductor manufacturers use the name.
24. LCC (Leadless chip carrier)
Leadless chip carrier. This refers to a surface-mount package where the four sides of the ceramic substrate have only electrode contact and no leads. High-speed and high-frequency IC packages, also known as ceramic QFN or QFN-C (see QFN).
25ã€LGA (land grid array)
Contact display package. That is, a package with an array of tan oxide electrode contacts is formed on the bottom surface. Insert the socket when assembling. Practical ceramic LGAs with 227 contacts (1.27 mm center-to-center distance) and 447 contacts (2.54 mm center-to-center distance) are used in high-speed logic LSI circuits.
LGA can accommodate more I/O pins in a smaller package than QFP. In addition, since the impedance of the lead is small, it is suitable for a high-speed LSI. However, because sockets are complicated to produce and costly, they are basically not used. It is expected that its demand will increase in the future.
26ã€LOC(lead on chip)
On-chip lead package. In one of the LSI packaging technologies, the front end of the lead frame is a structure above the chip, and bumps are made near the center of the chip and are electrically connected by wire sewing. Compared to a structure in which a lead frame is arranged near a side of a chip, a chip accommodated in a package of the same size has a width of about 1 mm.
27. LQFP (low profile quad flat package)
Thin QFP. The QFP with a package body thickness of 1.4mm is the name used by the Japan Electronics Industry Association in accordance with the new QFP form factor.
28, L-QUAD
One of the ceramic QFP. Aluminum nitride is used for the package substrate. The thermal conductivity of the substrate is 7-8 times higher than that of aluminum oxide and has good heat dissipation. The frame of the package is made of alumina, and the chip is sealed by the potting method, thereby suppressing the cost. It is a package developed for logic LSI that can tolerate W3 power under natural air cooling conditions. 208-pin (0.5mm center-to-center distance) and 160-pin (0.65mm center-to-center distance) LSI logic packages have been developed and started mass production in October 1993.
29ã€MCM (mulTI-chip module)
Multi-chip components. A package in which a plurality of semiconductor bare chips are assembled on a wiring substrate. According to the substrate material can be divided into MCM-L, MCM-C and MCM-D three categories.
MCM-L is a component using a general glass epoxy multilayer printed board. The wiring density is not high and the cost is low. MCM-C is a thick-film-technique multi-layer wiring with ceramic (aluminum oxide or glass ceramic) as a substrate component similar to a thick-film hybrid IC using a multilayer ceramic substrate. There is no significant difference between the two. The wiring density is higher than MCM-L. MCM-D is a thin-film technology used to form multilayer wiring with ceramic (alumina or aluminum nitride) or Si, Al as the substrate components. Cabling conspiracy is the highest among the three components, but the cost is also high.
30, MFP (mini flat package)
Small flat package. Plastic SOP or SSOP aliases (see SOP and SSOP). Some semiconductor manufacturers use the name.
The high-definition Hydrogel Screen Protector is made of TPU (polyurethane) material, which has high self-healing performance and anti-scratch performance. It is suitable for cutting with a Screen Protector Cutting Machine, but you need to pay attention to the angle of the blade when cutting to avoid cracking the Screen Protector.
Compared with other Screen Protectors, Hydrogel Screen Protectors have the following advantages:
1. HD Clear: The Hydrogel Screen Protector has an ultra-thin thickness of 0.14mm and high transparency. It will not affect the display effect of the mobile phone screen, and users can enjoy a clearer display effect.
2. Self-healing: The Hydrogel Screen Protector can automatically repair minor scratches or damage when encountering minor scratches, abrasions, etc., so that the screen remains perfect. Therefore, the lifespan of the screen protector can be extended.
3. Full coverage: The Hydrogel Screen Protector uses a high-permeability adhesive with strong adhesion. The flexible hydrogel film tightly fits the entire device screen without warping the surface, providing maximum protection for your screen
4. Sensitive touch and anti-fingerprint: The ultra-thin material provides a sensitive touch, which significantly improves the touch sensitivity when playing games. Built-in oleophobic and anti-fingerprint coating protects your screen from fingerprints and oil stains and is easy to clean.
HD Hydrogel Screen Protector is a powerful Screen Protector with perfect protection and repair effects, and also has the advantages of high transparency and no bubbles, which is an ideal choice for protecting your screen.
HD Screen Protector, High-Definition Screen Protector, HD Hydrogel Film, HD Clear Screen Protector, Hydrogel Film,HD Hydrogel Screen Protector
Shenzhen Jianjiantong Technology Co., Ltd. , https://www.tpuscreenprotector.com