HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology. The HDI board has inner layer lines and outer layer lines, and then uses drilling, in-hole metallization and other processes to realize the internal connection of each layer of lines.
HDI boards are generally manufactured by the lamination method. The more the number of laminations, the higher the technical grade of the board. Ordinary HDI boards are basically one-time buildup, and high-end HDI uses two or more buildup technologies, while using advanced PCB technologies such as stacking, electroplating, and laser direct drilling.
When the density of the PCB increases beyond the eight-layer board, the cost of using HDI will be lower than that of the traditional complex lamination process. HDI board is conducive to the use of advanced packaging technology, and its electrical performance and signal accuracy are higher than traditional PCBs. In addition, HDI board has better improvement for radio frequency interference, electromagnetic wave interference, electrostatic discharge, heat conduction, etc.
Electronic products are constantly developing towards high density and high precision. The so-called "high" not only improves the performance of the machine, but also reduces the size of the machine. High Density Integration (HDI) technology enables more miniaturization of end product designs while meeting higher standards for electronic performance and efficiency. Currently popular electronic products, such as mobile phones, digital (camera) cameras, notebook computers, automotive electronics, etc., many use HDI boards. With the upgrading of electronic products and market demand, the development of HDI boards will be very rapid.
General PCB introduction
PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support body for electronic components, and a carrier for electrical connection of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board.
Its function is mainly to avoid manual wiring errors due to the consistency of similar printed boards after electronic equipment adopts printed boards, and can realize automatic insertion or placement of electronic components, automatic soldering, and automatic detection to ensure Improve the quality of electronic equipment, improve labor productivity, reduce costs, and facilitate maintenance.
Are all pcb boards with blind and buried holes called hdi boards?
HDI boards are high-density interconnected circuit boards. The boards that are plated with blind holes and then pressed again are all HDI boards. They are divided into first-order, second-order, third-order, fourth-order, and fifth-order HDI. For example, the main board of iPhone 6 is fifth-order HDI.
Simple buried vias are not necessarily HDI.
How to distinguish HDI PCB first-order, second-order and third-order
The first order is relatively simple, and the process and process are easy to control.
The second-order ones start to be troublesome, one is the alignment problem, and the other is the problem of punching and copper plating. There are many kinds of second-order designs. One is that the positions of each order are staggered. When the second adjacent layer needs to be connected, it is connected in the middle layer through wires, which is equivalent to two first-order HDIs.
The second is that the two first-order holes are overlapped, and the second-order is realized by superposition. The processing is similar to the two first-order holes, but there are many process points that need to be specially controlled, which is mentioned above.
The third is to punch directly from the outer layer to the third layer (or N-2 layer). The process is very different from the previous one, and the difficulty of punching is also greater.
The second-order analogy is the same for the third-order.
The difference between HDI board and ordinary PCB
The common PCB board is mainly FR-4, which is made of epoxy resin and electronic-grade glass cloth. Generally, for traditional HDI, adhesive-backed copper foil is used for the outermost surface. Because laser drilling cannot penetrate glass cloth, adhesive-backed copper foil without glass fiber is generally used. However, the current high-energy laser drilling rig can penetrate 1180 glass cloth. . This is no different from ordinary materials.
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