The LED industry is about to face a huge change. As the white LED patents owned by Nichia will be released in 2017, domestic LED companies will no longer be subject to the white light patent barrier. For example, today Yahua also plans to deploy the patented technology of flip chip LED and chip size package (CSP). It is expected that the patent competition of LED industry will enter a new era. Flip chip packaging and CSP will become the main battlefield.
Since 2015, Han TV brand manufacturers have adopted flip-chip LEDs as LED backlights. Since 2016, more and more mainland manufacturers and other brands will actively promote flip-chip LEDs in TV backlights, even smaller CSP LEDs. . The market estimates that the penetration rate of flip-chip LED technology in TV LED backlights will increase to more than 50% in 2017.
The so-called CSP full name Chip Scale Package, traditionally defined as the same package size as the LED chip, or a package that is no larger than 20% of the LED chip and is fully functional. In the traditional semiconductor industry, the main purpose of this technology is to reduce the package size, improve chip reliability, and improve chip heat dissipation.
As the technology is still in the development stage, the CSP schemes of the various industry players are slightly different. Take Taiwan New Century Company as an example, the coating of the support and the phosphor powder is completed on the wafer, and then cut into crystal grains. This packaging process is also called Wafer Level Package. The product advantages include higher unit brightness (lm/area), thinning, and lower cost.
At present, domestic LED companies such as Sanan Optoelectronics, etc. are mainly built in the traditional LED industry chain, but the market price has been destroyed and become the Red Sea market. In contrast, flip chip and CSP technology will be used in ultra-thin side-lit TVs, ultra-thin mobile phones, and special applications such as flashlights and automotive lighting.
In particular, the technical threshold of the automotive LED lighting market is high, and the product profit is superior to other applications. In recent years, it has become an important market for various LED manufacturers to compete for. According to industry estimates, the output value of the LED market for exterior lighting in 2015 is estimated to be $1.21 billion, and by 2020 it will grow to $2.99 ​​billion, with a compound annual growth rate of 8%. The so-called exterior lighting includes direction lights, fog lights, far and near lights and position lights, especially the headlights (far near lights) have the highest technical content, but the LED headlamp module has the highest growth rate, and the annual compound growth rate. Up to 11%.
The flip-chip LED and CSP products have the advantages of no wire bonding, dense alignment, low thermal resistance, high luminous efficiency, etc., which are helpful for the application of the headlights, and the wire-free can eliminate the wire breakage caused by the LED vibration, and the flip chip can be more The compact arrangement and effective concentration of the light source area are conducive to the optical design and optical requirements of automotive lighting.
At present, the automotive LED market is mainly monopolized by international manufacturers, and the product certification period is long. Therefore, it is not easy to cut into the original supply chain of the automobile in a short period of time. Due to the maturity of related technologies, 2016 will be able to be repaired in the after-sales service. The After Market is the first to ferment.
Although the flip-chip LED and CSP products have a wide range of downstream seaports, there are not many suppliers with stable mass production capacity in the world, which means that technology leaders are expected to transform towards differentiated and high value-added applications. As the market demand increases, the future penetration rate will increase quarter by quarter. The market is expected to become the mainstream of the market in the next 3 to 5 years, changing the current stage of the industry's horizontal line-type grain, and the proportion of traditional horizontal grain. It is expected to be below 40% in 2017.
More importantly, because CSP technology omits the traditional wire-wrapping process, Epistar will be able to directly face the end-system customers, cooperate with downstream system manufacturers, occupy the role of design in solution provider in the industry chain position, and understand customers in real time. Respond quickly to demand. At the same time, it has the complete patent of epitaxial, flip chip and CSP, which will be the opportunity for LED epitaxial plant to enter the new blue sea.
Looking into the future, as China moves from the 12th Five-Year Plan to the 13th Five-Year Plan, the target of industrial subsidies has been transferred to the semiconductor industry, and the amount of LED subsidies has been greatly reduced. It is expected to help ease the pressure of falling prices. Recently, the market water level has also decreased. In the LED killing trend is close to the bottom, it is expected that the kinetic energy of customers' new products will be expected to emerge in the first quarter.
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