TDK launches CeraPad? Ultra-thin substrate with integrated ESD protection

LED light-emitting diode

ESD TVS electrostatic protection tube 0201 package 3.3V ultra low capacitance ESD

The TDK Group has recently introduced the new ultra-thin ceramic substrate CeraPadTM , which is designed in a multi-layer structure and incorporates ESD protection in it, eliminating the need for separate ESD components. This innovative substrate meets the needs of extreme miniaturization and features the best ESD protection for maximum integrated ESD protection in sensitive applications.

CeraPad ceramic substrates have an ESD protection capability of up to 25kV, while the current state-of-the-art Zener diodes have a standard protection of only 8kV. CeraPad ceramic substrates offer up to three times better ESD protection than conventional products. In addition, the ceramic substrate has a thickness of only 300 μm to 400 μm, but has a thermal conductivity of up to 22 W/mK, which is also three times that of the conventional carrier. According to customer requirements, CeraPad's contact pads can be designed according to the welding process requirements, and can be applied to standard SAC (Sn / Ag / Cu, 260 ° C) reflow or eutectic solder (AuSn, 320 ° C) process.

Today, with the ever-increasing number and density of LEDs, this new technology is particularly suitable for a variety of LED applications. CeraPad reduces the standard LED component custom chip package (CSP) from CSP1515 to CSP0707. In addition, CeraPad has a very low coefficient of thermal expansion (6ppm/mK), which is almost the same as the thermal expansion coefficient of LEDs. Therefore, when the temperature changes, there is almost no mechanical stress between the substrate and the LED.

Similar to PCB boards, the multi-layer technology of CeraPad ceramic substrates can also be designed to integrate certain integrated circuits by re-distributing each layer inside. In general, today's matrix LEDs contain multiple dual LEDs in series. In contrast, the new CeraPad module enables the first implementation of a new type of LED array in which hundreds of LED source points can be independently controlled. Application designers will be able to use this technology to create innovative high-resolution and secure lighting effects in the smallest spaces, such as multi-LED flashlights on smartphones or adaptive headlights for cars.

With CeraPad ceramic substrates, TDK Group is able to offer its customers an attractive custom packaging solution that allows them to better meet the challenges of rising IC sensitivities in the future, allowing customers to take advantage of a whole new approach. Lighting design and also improved the lighting efficiency of LEDs.

main application

· LED system for car headlights and smartphone flash

·Car ECU, smartphone and tablet

Main features and advantages

· ESD protection integrated in multi-layer substrate

· ESD protection capability up to 25kV

· Thermal conductivity up to 22W/mW

· Ultra-thin thickness from 300μm to 400μm